Teledyne
Imaging Sensors delivers standard and custom
imaging subsystems. This includes packaged focal plane arrays
incorporating optics,
coolers, or board electronics – to satisfy customer specified
requirements such as mechanical, optical, thermal, and electrical
interface.
In a soon
to be offered product, Teledyne Imaging Sensors developed an
FPA support Application Specific Integrated Circuit (ASIC),
which
provides clock and bias generation for FPA operation, and image
processing – gain and offset correction and analog-to-digital
conversion. This ASIC can replace multiple boards of support
electronics, leading to compact imaging subsystems.
For
more information contact us at:
imaging@teledyne-si.com |
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