Teledyne Imaging Sensors supplies three distinct visible imaging technologies: Monolithic CMOS, Hybrid Visible Silicon (HyViSI™), and substrate-removed MCT.

Monolithic CMOS is a superior alternative to conventional charge-coupled device (CCD) type imagers in terms of low noise at high frame rates, anti-blooming, and radiation hardness.

Hybrid Visible Silicon (HyViSI™) provides higher performance with silicon pin detectors for wide spectral response (0.4µm to 1.1µm) and high fill factor (>98%), while allowing more pixel area for low noise, wide dynamic range, and snapshot integration circuitry.

A third visible imaging option is “substrate removed” MCT, an infrared detector technology that responds to both infrared light and visible light by removal of the visible light-blocking substrate.