GaAs Millimeter Wave/Sub-Millimeter Wave Schottky Diodes.

New GaN THz Schottky Diodes​pdf File
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Teledyne Scientific Company offers a wide variety of millimeter-wave and submillimeter-wave planar airbridged Schottky diodes for applications in the 10 GHz to over 2.5 THz range.

Unique Diode Properties

  • Junction capacitance as low as 2fF allowing cutoff frequency >2THz
  • Very low parasitic capacitance < 9fF
  • Ultra low series resistance < 3Ω
  • Airbridged anode contact for low parasitic operation
  • Fully passivated by SiN
  • Flip chip and beamlead geometry
  • Space qualifiable construction
  • MMIC backend process available for integrated passives and vias

  • Unique gold stand-off platforms for ruggedness in flip-chip applications

GaAs Schottky Diode Products:

 Square Shapped Single
Part Number (PDF) VF@ 1mA (mV) CJunction* CTotal** VR @ -5uA Geometry Chip Dimension
TSC-SSS-05425 660-750 23 fF 64 fF -5V min FlipChip 11.3 mil x 11.3 mil
TSC-SSS-06225 660-750 30 fF 75 fF -5V min FlipChip 11.3 mil x 11.3 mil
TSC-SSS-07025 660-750 39 fF 87 fF -5V min FlipChip 11.3 mil x 11.3 mil

 Small Profile Single Antiparrallel
Part Number (PDF) VF@ 1mA (mV) CJunction* CTotal** VR @ -5uA Geometry Chip Dimension
TSC-SS-0112 730-950 1.1 fF 14 fF -5V min FlipChip-Single 5.1 mil x 3 mil
TSC-SAP-0109 700-850 1.1 fF 14 fF** -5V min FlipChip-Antiparrallel 5.1 mil x 3 mil

 Inverted-TEE

Part Number (PDF)

VF@ 1mA (mV)

CJunction*

CTotal**

VR @ -5uA

Geometry

Chip Dimension
TSC-IT-01025 730-950 1.1 f F F -5V min FlipChip 22.2 mil x 5.1 mil
TSC-IT-02025 0 4.3 fF 23 fF -5V min FlipChip 22.2 mil x 5.1 mil

 TEE
Part Number (PDF) VF@ 1mA (mV) CJunction* CTotal** VR @ -5uA Geometry Chip Dimension
TSC-T-01025 730-950 1.1 fF 18 fF -5V min FlipChip 22.2 mil x 5.1 mil
TSC-T-02025 700-850 4.3 fF 23 fF -5V min FlipChip 22.2 mil x 5.1 mil

 Antiparrallel

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​Part Number (PDF) ​VF@ 1mA (mV) ​CJunction* ​CTotal** ​VR @ -5uA ​Geometry ​Chip Dimension (GaAs only)
​TSC-AP-02020 700-850​ 4.3 fF​ ​23 f -5v min ​FlipChip ​14 mil x 5.1 mil​
TSC-AP-03020 700-850 ​9.8 fF 30 fF​ ​-5v min ​FlipChip 14 mil x 5.1 mil​
TSC-AP-04020​ 650.800​ ​17 fF ​40 fF -5V min​ ​FlipChip 14 mil x 5.1 mil​
TSC-AP-02020 700-850​ ​4.3 fF 23 fF​ -5V min​ ​Beamlead 14 mil x 5.1 mil​
TSC-APB-03020​ 700-850​ ​9.8 fF ​30 fF ​-5V min Beamlead​ 14 mil x 5.1 mil​
​TSC-APB-04020 ​650-800 17 fF​ 40 fF​ -5V min​ ​Beamlead 14 mil x 5.1 mil​

 Single

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​Part Number (PDF)​VF@ 1mA (mV)​CJunction​CTotal​VR @ -5uA​Geometry​Chip Dimension (GaAs only)
 TSC-S-01020730-950​1.1 fF​18 fF​-5V min​FlipChip​14 mil x 5.1 mil​
​TSC-S-02020​730-8504.3 fF​23 fF​-5V min​FlipChip​14 mil x 5.1 mil​
​TSC-S-03020​730-8509.8 fF​​30 fF-5V min​FlipChip14 mil x 5.1 mil​
​TSC-S-04020​650-80017 fF​40 fF​-5V min​FlipChip​14 mil x 5.1 mil​
​TSC-SB-01020​730-9501.1 fF​18 fF​-5V min​Beamlead​14 mil x 5.1 mil​
​TSC-SB-02020​700-850​4.3 fF23 fF​-5V min​Beamlead​14 mil x 5.1 mil​
​TSC-SB-03020​700-850​9.8 fF30 fF​-5V min​Beamlead​14 mil x 5.1 mil​
​TSC-SB-04020​650.80017 fF​40 fF​-5V min​Beamlead​14 mil x 5.1 mil​

 

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