Teledyne Scientific & Imaging
Semiconductor Fabrication Services combines uniquely multidisciplinary
and flexible processing capabilities with process control discipline to
enable a path from development to production in a wide range of
technologies. Our Fabrication Services has a proven track record of
delivering record device performances and working with customers in
successfully taking their technologies from R&D to production.
Our comprehensive fabrication service capabilities include:
- CAD layout, layout verification, data conversion
- High resolution E-beam lithography, typical resolution 20 nm - for applications such as T-gates, gratings, lenses
- Photolithography
- One GCA and two ASML 5X
steppers, with standard resolutions ranging from 0.65 um to 0.15 um,
suitable for a variety of lithography requirements
- Contact aligner, with standard resolution of 1um
- Dielectric deposition
- PECVD nitride, oxide
- Sputtered nitride
- LPCVD nitride, wet/dry oxide
- ALD – variety of metal oxides
- Spun-on BCB
- Metal deposition
- Evaporated metals typical in semiconductor wafer processing: Ag, Al, Au, Cr, In, Mo, Ni, NiCr, Pd, Pt, Si, Ti
- Sputtered metals: Al, Au, Cr, Mo, Ni, Pt, Si, TaN, Ti, W
- Ability to evaporate or sputter deposit custom metals and alloys
- Plated thick Au
- Dry Etch
- A wide array of RIE, ICP,
and resist asher tools with established processes for etching
dielectrics, semiconductors, deep Si, some metals, and resists
- Wet etch processes for metal liftoff, and etching dielectrics, metals, and semiconductors
- Thermal Anneal
- Maximum temperature 1200°C
- Process gases – N2, Ar, O2
- Ion implant
- Energy – up to 400 KeV
- Species – O2, As, He
- Backside processing
- Wafer lapping, polishing
- Wafer bonding
- Metrology/testing
- SEM (3) with EDX, AFM,
ellipsometry, profilometry, wafer stress measurement, electrical
characterization with manual probe stations, Electroglas autoprobers,
HP4145 parameter analyzers, and HP8510 network analyzers
We customize our
fabrication services to fit the individual needs of our customers.
Please contact us for further information about the services we can
provide to meet your processing requirements.
This image below is an example of High aspect ratio deep-Si etching
This image below is the Airbridged T-gates in a circuit
This last image below is Evaporated T-gate patterned with E-beam
