Ultra-compact microelectromechanical systems (MEMS) gyroscope incorporating wafer-scale vacuum packaging.

Teledyne Scientific Company develops advanced capabilities in microelectromechanical systems (MEMS) and micromachining technologies. We address a broad range of applications including RF sensors and communications, physical sensors, optical MEMS/microoptics, thermal management, high-density interconnects and frequency standards.

Our MEMS RF switches offer exceptional performance with superior insertion loss, isolation and linearity. The switches are incorporated into RF circuits, switching networks, and tunable filters. In addition, the switches can be monolithically integrated with RSC’s GaAs PHEMT MMIC circuits.

Teledyne Scientific Company offers complete, vertically integrated MEMS development capability, enabling end-to-end solutions. This includes in-house design capabilities, fabrication, testing, and prototype packaging of MEMS devices. An extensive selection of processes and tools are available to support optimum constructions for surface and bulk micromachined devices. Of particular note is Teledyne Scientific Company’s expertise in Si deep-etch technology, which can enable unique fine-line ratio structures.