Research and Development

Delivering the Winning Technical Edge™ by Providing R&D and Specialty Products 

HAWAII 4K x 4K 15 micron pixels (H4RG-15) standard readout integrated circuit (ROIC) wafer.

Teledyne Imaging Sensors focal plane arrays (FPAs) and imaging sensors cover a broad spectrum of light from below 0.3 micron ultra-violet to 18 micron long-wave infrared (LWIR). We offer large FPAs in 4096 x 4096 mosaics for a wide range of applications including ground-based and space-based astronomy. Our customers rely on us for solutions ranging from standard imaging products to custom products integrated with electronics and camera systems.

  •  Focal plane arrays and image sensors for government and commercial applications
  • Expertise in fabricating specialized Mercury Cadmium Telluride (HgCdTe) focal plane arrays in NIR, MWIR, and LWIR with near-theoretical performance
  • Proprietary FPA hybridization process to integrate imaging detectors with high-performance multiplexers
    Custom mixed-signal CMOS ROIC design and fabrication
    Hybrid visible silicon imager (HyViSi™) to displace charge coupled device imagers in high-end applications
    Proven track record of introducing large FPAs to market
    Camera system design
    Complete FPA packaging and characterization
    In-house molecular beam epitaxy and liquid phase epitaxy
    23,000 square feet of ISO 14644 cleanrooms
    AS9100C Certified